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PBA 313 02
BluetoothTM Radio
Key features
* A small complete class 1 Bluetooth Radio, no additional RF-components required * Variable reference frequency, 10 MHz-20 MHz * Excellent out-band blocking in all GSM bands * High signal level performance in-band * Requires no external shielding * On board software controlled output power * Qualified for Bluetooth specification 1.1
Description
The Bluetooth Radio PBA 313 02 from Ericsson Microelectronics is a long-range microwave frequency radio transceiver for Bluetooth communication links. Provided in a compact LGA package. No external shield is required. The Bluetooth Radio offers a combination of compact size, low power consumption, and cost effective assembly. The PBA 313 02 forms a complete radio with only the addition of an antenna, a reference frequency, and digital control. As a result, designers can benefit from a pre-tested and ready-to-use device, providing a robust Bluetooth Radio function in the final OEM application. PBA 313 02 is built around a BiCMOS ASIC. Antenna filter, RX and TX baluns are all integrated into the circuit. The antenna filter is specially designed for application in GSM environment such as inside a mobile phone. The PBA 313 02 has output power regulation control through software. Power levels have typical 4dB steps. Power control flexibility enables customer to specify smaller or larger power steps. Operating from a 2.7 V supply, the module has a typical supply current consumption of only 60 mA (receive mode) or 50 mA (transmit mode) at 0 dBm output power. In Standby mode the typical current consumption is only 20 A thus helping to extend battery life for portable equipment.
Suggested applications
* * * * *
Mobile phones PDA Modems Laptop computers Handheld equipment
PBA 313 02
SI* *CLK EXT_RESET
RX_DATA
RX_ON
ANTENNA
PBA 313 02/1
Control Det RX balun Power Control TX balun PA Switch Antenna filter
Radio ASIC
XO PLL
RSSI
Loop filter
VCO tank
SYNT_ON
PHD_OFF
TX_DATA
TX_ON
Figure 1. Block diagram
Limiting data
The absolute maximum ratings of the PBA 313 02 are summarised in Table 1. Unless otherwise noted, whenever VCC is mentioned it also includes VCC_DIG.
Absolute maximum ratings
Parameter Supply voltage PA Supply voltage Applied voltage to non supply pins Input RF power Storage temperature Max operating temperature Reference clock frequency Reference clock amplitude Max. load mismatch tolerant, stability Condition Symbol VCC1 VCC_PA Min 2.65 2.7 GND -0.3 Typ Max 3.0 5.5 Vcc +0.3 15 15 +90 +75 20 1.0 TBD Unit V V V dBm dBm C C MHz Vpp
XON
XOP
In-band Out-band TStg (fEXT_CLK) -40 -30 10 0.3
2
VCC_PA
TX_SW
VCC
PBA 313 02 Characteristic data
Unless otherwise noted, the specification applies forTAmb=25C, VCC =2.8V, fRef = 13MHz, 10ppm, VSWR 2:1, VCC_PA =3.2V
Operating conditions
Parameter Frequency range Reference clock frequency Reference clock frequency tolerance Reference clock amplitude Reference clock phase noice Supply voltage VCC Supply voltage VCC_PA Crystal tolerance Output matching of ANT pin Antenna load Logical input high Logical input low Rise/Fall time of all digital inputs Clock frequency of SI_CLK Positive period of SI_CLK Operating temperature
1)
Condition
1)
Symbol fEXT_CLK fEXT_CLK
Min 2.402 12.99987 0.8
Typ
Max 2.480 13.00013 10 -110 3.0 4.2 20 2:1 VCC +0.3 +0.3 20 4
f = 15 kHz 2.7
2)
2.775 3.2
Unit GHz MHz ppm Vpp dBc/Hz V V ppm V V ns MHz ns C
VSWR 50 VIH VIL 0.9x VCC -0.3 2 76 -20
TAmb
+25
+55
If an external clock input is used then the XO_N crystal input can be used. The external clock should be AC coupled into the XO_N input and the XO_P input shall be left unconnected. Crystal frequency can be trimmed by writing a 6-bit value to the XO_trim register in order to get 10 ppm frequency tolerance.
2)
DC and low frequency specifications
Parameter Supply current Condition Transmit mode 3) Receive mode Idle mode 4) Symbol Min Typ 50 60 20 3 3 0.4 0.4 3 5 20 VOH VOL 0.9xVcc -0.3 0 fEXT_CLK 1.0 3.2 250 VCC +0.3 Max Unit mA A pF pF pF pF pF A ns ns V V MHz MHz kHz ppm
50
XO_N input capacitance XO_P input capacitance XO_N Trim capacitance each step XO_P Trim capacitance each step Capacitance of all digital inputs Input leakage current Rise/Fall time of digital outputs 5) Rise/Fall time of RX Data Logical output high Logical output low SYS_CLK frequency TX_CLK frequency LPO_CLK frequency LPO_CLK frequency tolerance
3) 4) 5)
Max 63 steps (6bits) Max 63 steps (6bits) 0.5< VIN<(VCC -0.5) 2 15k+15pF
20
See Table 2. After at least 200 ms from shut down Driving a 10 pF load.
3
PBA 313 02
Receiver performance
Parameter Condition Symbol Frequency Range fRange Input and output impedance of ANT pin Input matching of ANT pin (VSWR) 6) Sensitivity level 2 BER = 0.1% Carrier offset = 75 kHz Frequency dev = 160kHz Max input level BER = 0.1% RSSI value (See Table 1) Co-Channel interference, C/Ico-channel Adjacent (1 MHz) interference, C/I1MHz Adjacent (2 MHz) interference, C/I2MHz Adjacent (3 MHz) interference, C/I3MHz Image frequency interference, C/Iimage 7) Adjacent (1MHz) interference to in-band Image frequency, C/Iimage+1MHz 7) Intermodulation rejection 7) LO leakage Spurious emission 30 MHz - 1 GHz 1 GHz - 12.75 GHz Out-of-band blocking 7) 30-880 MHz 10) 880-915 MHz 10) 915-1710 MHz 10) 1710-1785 MHz 10) 1785-1850 MHz 10) 1850-1980 MHz 10) 1980-2000 MHz 10) 2000-2100 MHz 10) 2100-2200 MHz 10) 2200-2300 MHz 10) 2300-3000 MHz 10) 3000-12750 MHz 10,11)
6) 8) 10)
Min 2.402
Typ 50 2:1 -86
Max 2.480
Unit GHz dBm
-83
+14 11 0 -30 -40 -9 -20 -39 -47 -47 -47 +11 +11 +11 +11 +11 +11 +11 0 -10 -13 -15 -5
dBm dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
-27 -27 -10
RX_ON must be high. Carrier signal level of -67 dBm, interferer Bluetooth modulated Carrier signal level of -67 dBm, Continuous Wave (CW) interferer.
7) 9) 11)
PX_ON high and 0xBF written to the Enable register. Carrier signal level of -60 dBm, interferer Bluetooth modulated Using two exemptions according to the BT specification
Table 1, RSSI performance
RSSI register value 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Min -85 -83 -81 -80 -79 -78 -77 -76 -74 -72 -69 -67 -66 -65 -64 -63 Typ -85 -81 -80 -78 -77 -76 -75 -74 -72 -70 -68 -66 -64 -63 -62 -61 Max -79 -78 -76 -75 -74 -73 -72 -70 -69 -66 -64 -62 -61 -60 -59 -59 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm RSSI register value 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Min -62 -61 -60 -58 -57 -54 -53 -52 -51 -50 -50 -49 -48 -47 -45 -44 Typ -60 -59 -58 -56 -54 -53 -51 -50 -49 -48 -47 -46 -45 -44 -43 -41 Max -57 -56 -54 -53 -52 -49 -48 -46 -46 -45 -44 -44 -43 -41 -40 -39 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
4
PBA 313 02 Transmitter performance
Parameter Condition Maximum TX power 15) Minimum TX power 15) Output power step size Frequency accuracy (excluding crystal accuracy) Frequency deviation 12) 0000111100001111 pattern Minimum frequency deviation 12) , 010101 pattern TX carrier drift 1 slot 13) (366 s) 3 slots (1598 s) 5 slots (2862 s) Drift rate 14) 20 dB bandwidth with peak det. Adjacent channel power 2 MHz 3 MHz 4 MHz Spurious emissions Harmonics, non-harmonics, <1 GHz, non-harmonics, >1 GHz Broadband noise 30 MHz-1.91 GHz 1.91 GHz- 2.3 GHz 2.5 GHz- 3.0 GHz 3.0 GHz- 12.75 GHz Output impedance Output VSWR
12) 13) 14) 15)
Symbol
Min 14 2
Typ 17
Max 20 +4 8 25 175 25 40 40 400 1 -20 -40 -40 -30 -36 -30
Unit dBm dBm dBm kHz kHz kHz kHz kHz kHz Hz/s MHz dBm dBm dBm dBm dBm dBm dB/Hz dB/Hz dB/Hz dB/Hz
140 115 fDrift1 fDrift1 fDrift1
-160 -120 -120 -130 50 2:1
Measured differentially. Measured in a 5-slot packet. Measured in a 5-slot packet using curve fitting to reduce noise influence. See Table 2.
Table 2, transmitter power levels 16)
TAmb=25C, VCC =2.7V, fRef = 13MHz, 10ppm, VSWR 2:1, VCC_PA =3.2V Register #16 setting Register #24 (XXXX XXXX XXXX ABCD) 17) setting (00100ABC) ABCD = 1111 1100 1001 1001 0111 1000 0111 0110 0110 0110 0101 0101
16) 17)
Pout Min 14 Typ 16.5 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 Max 20 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
ABC = 111 101 101 011 100 001 001 010 001 000 010 000
ITot (IVcc+IVcc_pa) Typ Unit 175 mA 120 mA 90 mA 75 mA 63 mA 62 mA 54 mA 49 mA 48 mA 47 mA 46 mA 45 mA
Power levels have typical 4dB steps. Power control flexibility enables customer to specify smaller or larger power steps. X= Don't care
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PBA 313 02
Table 3, digital control registers
Register name ext-PA-level VCO/mod. Test trim Chan RSSI XO trim ID LPO-hi LPO-lo Control CHP control Power Control Enable Fref # bits 16 8 8 5 7 8 1 8 8 8 8 8 21 R or W W W W R W R W W W W W W W Address 010000 = 16 010001 = 17 010010 = 18 010010 = 18 010011 = 19 010011 = 19 010100 = 20 010101 = 21 010110 = 22 010111 = 23 011000 = 24 011001 = 25 011010 = 26 Value at reset 00000000 00000000 10001010 00000010 XXXUUUUU 00000000 0100VVVV XXXXXXX0 00000000 01000010 00000000 00000000 00000000 XXX10011 11010110 00100000 00000000 XXX11111 11110101 00000010 XXX00000 00000000 00000000 00000000 00000000 Recommended Value See Table 2 10001010
MidTiming ModInc
8 21
W W
011011 = 27 011100 = 28
DsmIn
21
W
011101 = 29
DsmOut Mux
8 7
W W
011110 = 30 011111 = 31
Set during application trimming Set during application trimming Set during application trimming 01000010 00001000 See Table 2 Initial value Initial value Initial value Initial value Initial value Initial value Initial value Initial value Initial value Initial value Initial value Initial value Initial value
W=Writable, R=Readable, X=n.a., U=Undefined, V=Version number.
Table 4, short description of the PBA 313 02 pin-out.
(In the Type-column "A" denotes Analog bipolar and "D" Digital CMOS Pin No. A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 C6 C7 D1 D2 Pin name VCC RX_ON VCC_DIG TX_ON PX_ON VCC_PA ANT GND RX_DATA GND TX_CLK SYS_CLK_REQ GND GND GND SI_CDI LPO_CLK GND GND NC GND Type Power D in Power D in D in Power 50 Ground D out Ground D out D in Ground Ground Ground D in D out Ground Ground Ground Active High High High High High High Description Common power supply Receiver power on Digital power supply Transmit power on Packet on Power supply for external PA Antenna input/output Common ground Received data output Common ground 1 MHz clock System clock request Common ground Common ground Common ground Serial data input 3.2 kHz clock Common ground Common ground Not connected Common ground
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PBA 313 02
Pin No. D3 D4 D5 D6 D7 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 G* Pin name SYS_CLK SI_CMS SI_CDO GND GND GND XO_P XO_N PHD_OFF TX_DATA SI_CLK TX_SW NC EXT_RESET POR SYNT_ON NC NC Type D out D in D out Ground Ground Ground A in A in D in D in D in D in D in D out D in Active High High High High High Low High High Description System clock (13 MHz) Serial data interface Serial data output Common ground Common ground Common ground Crystal positive input Crystal negative input / external clock input Open PLL Transmit data Serial interface clock (4MHz) Controls the RX/TX switch Not connected External reset Power on reset Synthesiser power up Not connected Not connected & should not be grounded. (Only for mechanical support).
G1 G3 G4
G2
G6 G8
G7
G5
G9
G10
1 A B
2
3
4
5
6
7 C D E F
G11 G13 G14 G15 G19 G12
0.6 mm
1 mm
G16 G18
G17
Y
G20
X-Y origin (0,0) X
The dimensions are 11.8 x 11.8 0.2 mm
Figure 2. Mechanical dimensions of PBA 313 02. (Seen through the module from the component side)
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PBA 313 02
Physical dimensions
Parameter Length Width Thickness Coplanarity Min 11.6 11.6 Typ 11.8 11.8 Max 12.0 12.0 1.6 0.1 Unit mm mm mm mm
Table 5, Pad co-ordinates for module PBA 313 02
Reference point is down, left corner (0,0) and units are mm. Pad A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 C6 C7 X 3,4 4,4 5,4 6,4 7,4 8,4 3,4 4,4 5,4 6,4 7,4 8,4 3,4 4,4 5,4 6,4 7,4 8,4 9,4 Y 8,4 8,4 8,4 8,4 8,4 8,4 7,4 7,4 7,4 7,4 7,4 7,4 6,4 6,4 6,4 6,4 6,4 6,4 6,4 Pad D1 D2 D3 D4 D5 D6 D7 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 X 3,4 4,4 5,4 6,4 7,4 8,4 9,4 3,4 4,4 5,4 6,4 7,4 8,4 3,4 4,4 5,4 6,4 7,4 8,4 Y 5,4 5,4 5,4 5,4 5,4 5,4 5,4 4,4 4,4 4,4 4,4 4,4 4,4 3,4 3,4 3,4 3,4 3,4 3,4 Pad G1 G2 G3 G4 G5 G6 G7 G8 G8 G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 G19 G20 X 0,8 2,4 1,6 0,8 2,4 9,4 11,0 10,2 10,2 9,4 11,0 0,8 2,4 1,6 0,8 2,4 9,4 11,0 10,2 9,4 11.0 Y 11,0 11,0 10,2 9,4 9,4 11,0 11,0 10,2 10,2 9,4 9,4 2,4 2,4 1,6 0,8 0,8 2,4 2,4 1,6 0.8 0,8
PBA 313 02/1 P1N
Figure 3. Orientation of PBA 313 02 (Top and bottom layers of the module shown in the same orientation).
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PBA 313 02 Functional description
PBA 313 02 is a long-range transceiver module for Bluetooth applications. The transceiver operates in the globally available 2.4 - 2.5 GHz ISM band. The module is a class 1 Bluetooth device. The transceiver module is based on a BiCMOS application specific integrated circuit (ASIC). The antenna filter, the RX and TX baluns, and the switch are all at least partially integrated into the ceramic substrate onto which the components of the module are mounted. The maximum output power is +20 dBm and the sensitivity (0.1% bit error rate) is -86 dBm (typical), measured at the antenna pin. The transmitter consists of a gaussian low pass filter to shape the data before it directly modulates the voltage controlled oscillator, which is run in open loop during transmit. The VCO is buffered before driving the PA on the module. The module output power is controlled by varying the buffer and PA gain
VCO-tank
Part of the phase locked loop. The modulation is performed directly on the VCO. To ensure high performance the VCOtank is laser trimmed.
Loop filter
Generates the tuning voltage of the VCO-tank.
Block diagram
PBA 313 02 is based on a single chip radio ASIC that utilises a heterodyne receiver architecture with low intermediate frequency. The transmitter utilises direct modulation of the voltage controlled oscillator. A fractional N synthesiser is used to enable different reference frequencies to be used. There are also a number of other circuit blocks including a crystal oscillator, a low power oscillator, power on reset and frequency divider. The chip is controlled by the serial interface. The block diagram in figure 4 shows the simplified architecture of the radio ASIC and seven major supporting blocks on the module:
RX balun
Transformation from unbalanced (single-ended) to balanced (differential) transmission. The major part of the balun is integrated in the substrate. TX balunBiasing of the output amplifier in the radio ASIC and transformation from balanced to unbalanced transmission. The major part of the balun is integrated in the substrate.
Antenna switch
Directs the power either from the antenna filter to the receive port or from the external PA output port to the antenna filter.
Antenna filter
Front end bandpass filter fully integrated in the ceramic substrate.
Radio ASIC
The receiver on the radio ASIC consists of a low noise amplifier, followed by an image reject down converter. The low IF signal of the mixer is fed to an on chip selectivity filter. This is followed by a limiter, which generates the RSSI and also maximises the signal before it is fed to the demodulator. This is followed by a post detection filter and a slicer, which outputs the data to a baseband.
External PA
Two stage GaAs Power Amplifier that operates from a single supply and boosts the output power up to +20dBm, mounted on the module. The output power is controlled by an analogue signal from the ASIC.
SI* *CLK EXT_RESET
RX_DATA
RX_ON
ANTENNA
PBA 313 02/1
Control Det RX balun Power Control TX balun PA Switch Antenna filter
Radio ASIC
XO PLL
RSSI
Loop filter
VCO tank
SYNT_ON
PHD_OFF
TX_DATA
TX_ON
Figure 4. Block diagram.
XON
XOP
VCC_PA
TX_SW
VCC
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PBA 313 02 I/O signal description
Power supply
There are three connections feeding the Bluetooth radio, VCC, VCC_DIG and VCC_PA. VCC supplies the sensitive RF circuitry. It's important that this supply is proper decoupled and free from noise and other disturbances. VCC_DIG feeds the digital circuitry of the module. The power amplifier is fed from the VCC_PA rail. To avoid AM modulation on the TX signal this pin should also be decoupled. the radio until a layer can be used as a local ground plane. The Bluetooth radio will be self-shielding and no additional shields should be necessary for normal operating conditions.
Antenna
The ANT pin should be connected to a 50 antenna interface, thereby supporting the best signal strength performance. Ericsson Microelectronics partners can support application specific antennas.
Input control
There are five digital inputs available for the radio controlling features of the PBA 313 02. The Bluetooth timing requirements for these are described in table 6 and figure 5. In addition, there is a digital input signal for hardware reset of the radio, and a digital input signal for waking up the clock circuitry after a sleep mode period.
Oscillator or external clock input
XO_N and XO_P connects to the crystal's inputs. The load capacitance to the crystal can be trimmed using the XO-Trim register (Depending on crystal, no external load capacitors are required). If an external clock is used, it should be AC coupled into the XO_N input and the XO_P input shall be left unconnected.
PX_ON
Packet switch on control is active `high'. Activate this signal during reception of a Bluetooth payload. PX_ON is used to control the Slicer of the receiver. Since the General Inquiry Access Code (GIAC), information in a Bluetooth packet header contains an equal number of one's (+FMOD) and zero's (-FMOD), the average frequency will always be centred on the carrier frequency. This provides the Slicer the reference for the fast tuning. If the fast mode is not used during the header then the first bits could be interpreted incorrectly. The slow mode gives a more accurate FSK compensation of the thresholds for a one and a zero compared to the fast mode; therefore, the BER is less. The fast mode (time constant < 2s) is used when PX_ON is deactivated and the slow mode (time constant < 50s) when it is activated.
Ground
Ground should be distributed with very low impedance as a ground plane. Connect all GND connections to the ground plane. It is critical to have a ground plane underneath the Bluetooth radio in order to shield the VCO tank from any electrical noise. The ground vias purpose is to connect the local ground plane to the main ground layer. Note: If a local ground plane cannot be directly placed underneath the radio, then no routing should be planned underneath
TX SLOT
SYNT_ON SI TX_ON TX_SW PHD_OFF TX_DATA RX_ON RX_DATA PX_ON tTO tTD ts t PHD to tR O tRD ts to
RX SLOT
SYNT_ON
Synthesiser on control is active `high'. Activate this signal to power up of the VCO section of the radio. SYNT_ON is used in both transmit and receive mode. This activates the PLL as well as the VCO.
RX_ON
Receive-on control is active `high'. Activate this signal to enable reception of Bluetooth data on the RX_DATA pin. The transmit-on control (TX_ON) must be deactivated and the synthesiser (SYNT_ON) activated if data is to be received. Min Typical Max 625 1875 3125 223 366 1598 2862 213 Unit s s s s s s s s s s s
Figure 5. Timing sequence for data transmission.
Symbol tS tS tS tTO tTD tPHD tD tD tD tRO tRD
Parameter One Slot time Two Slot times Three Slot times Transmitter On delay Delay before transmitting data Phase Detector Off delay after tTO Data sending period, one slot Data sending period, two slots Data sending period, three slots Receiver On delay Delay before receiving data
203
102 213 104
175 213
Table 6. Timing requirements for data transmission.
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PBA 313 02
TX_ON
Transmit-on control is active `high'. Activate this signal to enable radio signal output on the ANT pin. The actual transfer of data that exists on the TX_DATA input occurs when PHD_OFF goes `high'. The receive-on control, RX_ON, must also be `low' and the transmit-switch, TX_SW, be held "high" if data is to be transmitted.
POR
Power-on-reset digital output is activated after the power has been applied to the Bluetooth radio or on a positive edge of the POR_EXT digital input. POR has a transition from `low' to `high' after four clock cycles have been delivered to the baseband chip, see figure 6.
TX_SW
Transmit-switch is active "high". This switch controls which one of the TX_PA and the RX balun to be connected to the antenna. During TX mode it should be held "high", the rest of the time it should be "low". In system without a dedicated control pin this signal can be connected to the TX_ON signal.
SYS_CLK
13 MHz system clock digital output available for the baseband circuitry when the POR_EXT and SYS_CLK_REQ are both `high'. SYS_CLK will also be available during startup, independent on the value of SYS_CLK_REQ.
TX_CLK
1 MHz transmit clock digital output available for the baseband circuitry when the POR_EXT and SYS_CLK_REQ (see above) are both `high'. TX_CLK changes value on rising edges of SYS_CLK.
PHD_OFF
Phase detector off control is active `high'. Activate this signal in transmit mode to open the phase locked loop (PLL) employed in the VCO section and enable modulation of the carrier using the TX_DATA digital input. PHD_OFF is activated after the initialisation of the SYNT_ON signal and the TX_ON signal.
LPO_CLK
3.2 kHz low power oscillator clock digital output that is adjustable by setting the internal LPOHI and LPOLO registers (see figure 6).The clock output is available as soon as the power supply is applied and POR_EXT is `high'. The LPO is necessary for wake-up timing in the baseband circuitry, if the Ericsson baseband is used.
POR_EXT
External power on reset is active `high'. An external poweron-reset digital input signal that will reset the radio controller and its registers. A reset will occur on the positive edge of POR_EXT signal. The signal should remain high during operation.
Data interface
Two digital signals are used for data flow over the air interface.
SYS_CLK_REQ
System clock request control is active `high'. Once the crystal oscillator bit (XOCTR, control register, bit #2) has been set, use this control to switch off (sleep mode) and wake up (idle and operating modes) the reference clock circuitry and corresponding 13 MHz and 1 MHz clock output ports of the module.
TX_DATA
Transmit data digital control is active `high'18). The radio module feeds Bluetooth data (1 Mbit/s) directly19) to the radio frequency modulator when PHD_OFF is activated. The total delay from the TX_DATA pin to the ANT pin is typically 0.5 s.
18)
Output control
There are four digital output control signals available for controlling external baseband circuitry.
19)
The TX_polarity bit of Enable register should be set to '1' (positive polarity) for normal operation. A logic 'high' value will then result in a positive frequency deviation output on the ANT pin. Data on the TX_DATA pin is digitally buffered before it is fed to the radio frequency modulator.
0 VCC POR_EXT SYS_CLK_REQ
0.5ms
1.0ms
1.5ms
2.0ms Vcc '1'
2.5ms
3.0ms
3.5ms
4.0ms
'0' or '1'
LPO_CLK Control Register SYS_CLK POR
10000XX
Figure 6. Powering up the module.
11
PBA 313 02
RX_DATA
Receive data digital output is active `high'. The radio module latches out Bluetooth data (1 Mbit/s) on the RX_DATA pin on falling edges of SYS_CLK when RX_ON is activated. The total delay from the ANT pin to the RX_DATA pin is typically 2.5 s.
Assembly guidelines
Solder paste
The PBA 313 02 module is made for surface mounting with land grid array (LGA) gold solder joints. To assemble the module, solder paste (eutectic Tin/Lead) must be printed at the target surface. Preferred solder paste height is 100127m (4-5 mil).
Serial interface
The serial control interface is a JTAG Boundary-Scan Architecture (IEEE Std 1149.1). Interconnection between the serial interface and the external controller (baseband circuit) consists of four 1-bit digital signals; control data input (SI_CDI), control mode select (SI_CMS), control clock (SI_CLK) and control data output (SI_CDO). The timing of these signals are defined in figure 7. (Footnotes)
Soldering profile
It must be noted that the module should not be allowed to be hanging upside down in the reflow operation. This means that the module has to be assembled on the side of the PCB that is soldered last. The reflow process should be a regular surface mount soldering profile (full convection strongly preferred), the ramp-up should not be more than 3C/s and with a peak temperature of 210-225C during 10-20 seconds. Max sloping rate should not exceed 4C/s.
SI_ CLK SI_ CMS SI _CDI SI _CDO t2 t1 tSI_CLK2 tSI_CLK Min 200 76 20 Typ 250 76 Max Unit ns ns ns ns
Pad size
It is recommended that the pads on the PCB should have a diameter of 0.5-0.7mm. The surface finish on the PCB pads should be Nickel/Gold or a flat Tin/Lead surface or OSP (Organic Surface Protection).
Placement
The recommended pickup co-ordinates for the PBA 313 02 shield is based on a nozzle with inner diameter 2 mm and outer diameter 3.17 mm. The centre of the shield is the origin of co-ordinates, (0,0) for (x,y), giving the pickup coordinates (5.9mm, 5.9mm) for (x,y).
Storage
Keep the component in its dry pack when not yet using the reel. After removal from the dry pack ensure that the modules are soldered onto the PCB within 48 hours.
tSI_CLK tSI_CLK2 t1 t2
20
Figure 7. Timing diagram of the serial interface.
Temperature profile
250
max 120 s 10-20s
200
Temperature (C)
183C
max sloping 4C/s
150 100
max rising 3C/s
60-125 s
50 0 0 50 100
Time (s)
150
200
250
Figure 8. Temperature profile.
12
PBA 313 02
Module marking
Each module is marked on the shield with the following information:
* Ericsson logotype * Product No with index * Revision state * Manufacturing unit code * Production year and week * Bluetooth trademark * FCC product code * CE marking
Reel marking
The reel, reel box and dry pack has a label with the following information:
* Ericsson product number with revision * Customer product number with revision * Quantity * Reel-ID. (Batch No) * Factory code * Manufacturing date * Country of origin * Ericsson logotype
1-6 above is also printed in BAR-code format
Contacting Ericsson Microelectronics
For further information regarding Bluetooth technology, components and development tools, please contact Ericsson Microelectronics:
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Information given in this data sheet is believed to be accurate and reliable. However no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice.
Ericsson Microelectronics SE-164 81 Kista, Sweden Telephone: +46 8 757 50 00 Internet: www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int + 46 8 757 47 00, Fax: +46 8 757 47 76
The latest and most complete information can be found on our website!
Preliminary Data Sheet
EN/LZT 146 189 R1A (c) Ericsson Microelectronics AB, June 2002

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